Semiconductor Manufacturing Services
XC Machining produces precision semiconductor equipment components — wafer handler end-effectors, process chamber liners and rings, vacuum flange assemblies, electrostatic chuck (ESC) support structures, gas distribution manifolds, load port adapter plates, and wafer cassette frames — from aluminum 6061-T6, stainless steel 316L, PEEK, and quartz-compatible materials — to ±0.002 mm tolerance. Electropolished and cleanroom-packaged on request. DFM review within 12 hours. Parts in 5–15 business days from Dongguan, China.
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We Help From Prototyping to Production
Prototyping
Engineering Validation and Testing
Design Validation and Testing
Bring your early-stage medical designs to life with prototypes crafted from production-grade materials. Our process enables you to evaluate and optimize your designs, ensuring they are fully functional and ready for testing.
Production Validation and Testing
Mass Production
- Prototyping
- Tooling
- Jigs & Fixtures
- Surrogate parts
- Drones
- UAVs
- CubeSat
- Fuel pumps
- Structural components
- Small sensors
Industry Facilities
Enhance brand recognition with customized packaging that reflects your brand’s identity.
Materials for Semiconductor Parts
- Steel & stainless steel: 304/304L, 316/316L, 17-4PH
- Titanium: grade 1, grade 2, grade 5
- Aluminum: 6061-T6, 7075-T6, 5083-H111, 2024-T351
- Brass & copper alloys: C360, copper C110, copper C101
- Thermoplastics: Polycarbonate (PC), ABS, PLA, PEEK, Ultem 1010, PA 12
- Commodity polymers: Polyethylene (PE), Polypropylene (PP)
- Medical-grade, FDA-approved materials: available via Protolabs
Surface finishes for Aerospace Industry
Industry Expertise at XC Machining

Automotive Industry

Semi Conductor

Energy Industry

Industrial Machinery

Electronics

Communications

Robotics

Medical Devices
Bring Your Designs to Life with XC Machining
- Expertise Shared Widely
- Market Reach Expanded
- Advanced Technology Integrated
- Collaborative Innovation Opportunities
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Manufacture Through Latest Technology
Our Semiconductor Prototype Manufacturing Capabilities
Provides injection molding for prototypes and custom parts, emphasizing expert support, competitive pricing, and faster production cycles.
Get reliable vacuum casting services for high-quality prototypes and production parts at competitive prices. XinCheng offers highly detailed casting parts with consistent quality.
Uses cutting, bending, and forming techniques to produce precision metal components suited for industrial, commercial, and manufacturing applications.
Semiconductor Manufacturing Frequently Asked Questions
What Tolerance Does XC Machining Hold for Semiconductor Equipment Components?
Ultra-precision: ±0.002 mm on wafer handler end-effectors and electrostatic chuck support structures (5-axis CNC milling, temperature-controlled machining at 20°C ± 1°C, CMM verification at 100+ probe points). Standard semiconductor: ±0.005 mm on process chamber liners, vacuum flanges, and gas distribution manifolds. General equipment: ±0.01 mm on load port adapter plates and structural frames. Surface roughness: Ra 0.2–0.4 μm after electropolishing on stainless steel UHV parts.
What Materials Are Compatible with Semiconductor Process Environments at XC Machining?
Aluminum 6061-T6 (low outgassing, anodizable — wafer handling, chamber liners, structural), stainless steel 316L (electropolished to Ra 0.2 μm, UHV compatible — chamber walls, vacuum flanges), PEEK (chemical resistant to semiconductor process gases — wafer cassette inserts, seal rings), titanium Grade 2 (non-magnetic, etch-resistant — ion implant chambers), fused silica/quartz (CVD furnace tubes, UV process windows — machined with diamond tooling), and PTFE (chemically inert — chemical distribution gaskets).
Does XC Machining Provide Cleanroom Packaging for Semiconductor Parts?
Yes. XC Machining provides cleanroom-compatible cleaning and packaging: IPA wipe-down after machining, particle inspection, and double-bagging in anti-static polyethylene for Class 100 (ISO 5) or Class 1000 (ISO 6) delivery. Parts are shipped in rigid ESD-safe containers labeled with part number, lot number, material grade, surface finish specification, and electropolish confirmation. Material certificates and Certificate of Conformance provided with every semiconductor order.
Can XC Machining Machine Vacuum Flanges with ConFlat (CF) Knife-Edge Sealing Geometry?
Yes. XC Machining CNC turns stainless steel 316L ConFlat (CF) flanges to ±0.002 mm knife-edge sealing geometry — the precision required for copper gasket compression to achieve UHV leak rates below 10⁻¹⁰ mbar·L/s. ISO-K and ISO-F flanges machined to ±0.005 mm with O-ring groove dimensions per ISO 1609. All vacuum flange sealing surfaces are electropolished to Ra 0.4 μm before shipment.
What Is the Lead Time for Semiconductor Equipment Parts from XC Machining?
Standard semiconductor parts (±0.005 mm, aluminum 6061-T6, no electropolish): 5–10 business days. Ultra-precision parts (±0.002 mm, 5-axis CNC, CMM 100+ point verification): 10–15 business days. Electropolished stainless parts (machining + electropolish + cleanroom packaging): 10–15 business days. Quartz and silicon carbide: 15–25 business days (specialist material, diamond tooling required). DFM review and quote returned within 12 hours of STEP file upload from Dongguan, China.